Formation of 3-Dimensional Gold, Copper and Palladium Microelectrode Arrays for Enhanced Electrochemical Sensing Applications

Author:

Hay Catherine E.,Lee Junqiao,Silvester Debbie S.ORCID

Abstract

Microelectrodes offer higher current density and lower ohmic drop due to increased radial diffusion. They are beneficial for electroanalytical applications, particularly for the detection of analytes at trace concentrations. Microelectrodes can be fabricated as arrays to improve the current response, but are presently only commercially available with gold or platinum electrode surfaces, thus limiting the sensing of analytes that are more electroactive on other surfaces. In this work, gold (Au), copper (Cu), and palladium (Pd) are electrodeposited at two different potentials into the recessed holes of commercial microelectrode arrays to produce 3-dimensional (3D) spiky, dendritic or coral-like structures. The rough fractal structures that are produced afford enhanced electroactive surface area and increased radial diffusion due to the 3D nature, which drastically improves the sensitivity. 2,4,6-trinitrotoluene (TNT), carbon dioxide gas (CO2), and hydrogen gas (H2) were chosen as model analytes in room temperature ionic liquid solvents, to demonstrate improvements in the sensitivity of the modified microelectrode arrays, and, in some cases (e.g., for CO2 and H2), enhancements in the electrocatalytic ability. With the deposition of different materials, we have demonstrated enhanced sensitivity and electrocatalytic behaviour towards the chosen analytes.

Funder

Australian Research Council

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3