Evaluation of Potential Occupational Exposure and Release of Nanoparticles in Semiconductor-Manufacturing Environments

Abstract

Occupational exposure to airborne nanoparticles in semiconductor-manufacturing facilities is of growing concern. Currently, comprehensive information regarding atmospheric concentrations, potential origins, and the physical and chemical properties of nanoparticles in these industrial settings is lacking. This study investigated the occurrence of airborne nanoparticles within a semiconductor-research and -manufacturing facility, during both routine operation and maintenance activities. A Scanning Mobility Particle Sizer was used to monitor size-resolved airborne-nanoparticle number concentrations spanning the range of 6 to 220 nm. Breathing zone filter samples were also collected during maintenance processes and underwent subsequent analyses via Transmission Electron Microscopy and Inductively Coupled Plasma Mass Spectrometry, to discover the size, morphology, and chemical composition of the observed nanoparticles. The findings reveal low levels of airborne nanoparticles during routine operations, but maintenance tasks resulted in substantial concentration surges particularly for plasma-enhanced chemical vapor deposition tools with concentrations up to 11,800 particles/cm3. More than 80% of observed particles were smaller than 30 nm. These smallest particles were predominately composed of metals such as iron, nickel, and copper. Moreover, larger particles above 100 nm were also identified, comprising process-related materials such as silicon and indium. Comparative assessment against established mass-based exposure limits did not yield any exceedances. Current exposure limits do not typically consider size though, and the preponderance of small nanoparticles (<30 nm) would warrant a more size-differentiated exposure-risk assessment.