Carbon–Carbon Composite Metallic Alloy Joints and Corresponding Nanoscale Interfaces, a Short Review: Challenges, Strategies, and Prospects

Author:

Wang Chenyu12,Yang Yingguo13ORCID,Zeng Guangli12,Zhou Xingtai12,Huang Hefei12ORCID,Feng Shanglei12

Affiliation:

1. Shanghai Institute of Applied Physics, Chinese Academy of Sciences, Shanghai 201204, China

2. University of Chinese Academy of Sciences, Beijing 100049, China

3. School of Microelectronics, Fudan University, Shanghai 200433, China

Abstract

Brazing of carbon–carbon (C/C) composites with metallic materials currently faces a series of difficulties, such as the poor wettability of metallic materials on the surface, the nanoscale interface bonding of C/C composites and metallic materials, thermal stress problems for these different materials, etc. Especially, the practical problems, including the low joint strength and insufficient reliability, still limit the large-scale practical application of brazing technology for C/C composites and metal materials. Herein, in order to guide the fabrication of high-quality joints, we present a brief discussion on the latest research progress in the joints of C/C composites and metallic materials, including current challenges, solution methods, mechanisms, and future prospects. More importantly, the nanoscale interface in the carbon–carbon composites and metallic alloys is paid very little attention, which has been critically discussed for the first time. Then, we further outline the possible solutions in joint problems of C/C composites and metallic materials, proposing feasible strategies to control the reaction in the brazing process, such as surface treatments, the addition of reinforcing phases, a transition layer sandwiched between the base material and the intermediate layer, etc. These strategies are being envisioned for the first time and further contribute to promoting the converged applications of C/C composites and metallic materials.

Funder

National Natural Science Foundation of China

Shanghai Sailing Program

Publisher

MDPI AG

Subject

Inorganic Chemistry,Condensed Matter Physics,General Materials Science,General Chemical Engineering

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