Effect of Plasma Etching Depth on Subsurface Defects in Quartz Crystal Elements
Author:
Li Qingzhi1, Zhang Yubin1ORCID, Shi Zhaohua1, Li Weihua1, Ye Xin1ORCID
Affiliation:
1. Rsearch Centre of Laser Fusion, China Academy of Engineering Physics, Mianyang 621900, China
Abstract
After the plasma etching of quartz crystal, the crystal lattice underwent changes in response to the length of plasma etching time. The lattice arrangement of quartz crystal was the most orderly after plasma etching for 1000 nm, and with the increase in etching time, the lattice arrangement became less orderly again. The weak absorption value of quartz crystal was also consistent with this conclusion. In this paper, we investigated the effect of lattice changes on the damage threshold of quartz crystals by characterizing the quartz crystals using Reactive Ion Etching (RIE). We also examined the effect of lattice variation on roughness and surface topography.
Funder
Joint Fund of the National Natural Science Foundation of China and the China Academy of Engineering Physics The Open Project Program of Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Ministry of Education, Changchun University of Science and Technology
Subject
Inorganic Chemistry,Condensed Matter Physics,General Materials Science,General Chemical Engineering
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