First-Principles Study of the Effect of Sn Content on the Structural, Elastic, and Electronic Properties of Cu–Sn Alloys

Abstract

In order to explore the mechanism of the influence of Sn contents on the relevant properties of Cu–Sn alloys, the structure, elasticity, electronic, and thermal properties of Cu–Sn alloys doped with different proportions of Sn (3.125 at%, 6.25 at%, and 9.375 at%) were established using the first-principles calculation based on density functional theory. Firstly, their lattice constants and Sn concentration comply with Vegard’s Law. From the mixing enthalpy, it can be seen that Sn atoms can be firmly dissolved in the Cu matrix, and the structure is most stable when the Sn content is 3.125 at%. In addition, the introduction of mismatch strain characterized their solid solution strengthening effect. The elastic and electronic properties showed that when the Sn content is 6.25 at%, the Cu–Sn alloy has the best plasticity and the highest elastic anisotropy; when the Sn content is 3.125 at%, the Cu–Sn alloy is the most stable and has stronger bulk and shear modulus, which was mainly due to a stronger Cu-Cu covalent bond. Finally, the Debye temperature, thermal conductivity, and melting point were calculated. It is estimated that the thermal conductivity of Cu–Sn alloy is relatively good when the Sn content is low.