Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors

Abstract

As the second-generation high-temperature superconducting conductors, rare earth–barium–copper–oxide (REBCO) coated conductor (CC) tapes have good potential as high-field and high-energy superconductors. In superconducting applications, several joints are required for conjugating comparatively short REBCO CC tapes. Soldering lap joints are the simplest and most commonly applied REBCO CC joints. In addition to joint resistance, the mechanical behavior and electromechanical properties are also crucial for superconducting applications. In this paper, the electromechanical properties and mechanical behaviors of soldering lap joints at 77 K under a self-field were studied. The mechanical behavior was addressed by using a full three-dimensional multilayer elastic–plastic finite element model (FEM) with REBCO CC tape main layers and solder connecting layers. Then, the electromechanical properties were analyzed by using Gao’s strain-Ic degradation general model on the basis of the FEM results. Both the mechanical behavior and electromechanical properties were verified by experimental results. The effects of soldering lap conditions including lap length, soldering thickness and lap style on the electromechanical properties and mechanical behaviors were discussed. The results indicate that shorter overlap lengths and a thinner solder can reduce the premature degradation of Ic due to stress concentrations nearby the joint edges; moreover, the irreversible critical strain is significantly higher in the back-to-back joint approach compared to the widely used face-to-face joint approach.