Influence of Carbon Source on Microstructural and Mechanical Properties of High-Performance Reaction-Bonded Silicon Carbide

Author:

Zhou Yabin,Sha Wenhao,Liu Yingying,Lyu Yinong,Huang Yihua

Abstract

Reaction-bonded silicon carbide (RBSC) has become an important structural ceramic with the benefit of being capable of preparing complex-shaped products. In order to fabricate high-performance RBSC, particle gradation of raw SiC combined with slip casting was used to prepare the porous preform before liquid silicon infiltration (LSI). The microstructural and mechanical properties of RBSC were compared by adding different amounts of carbon black (CB) content from 4 wt% to 10 wt%. Two pore structures with submicron and nano pores formed in the preform. As the amounts of carbon black increased, the mechanical properties improved and then suddenly weakened due to residual silicon initiating a nonuniform microstructure. The elastic modulus of the preform with 8 wt%CB after LSI was 389 ± 4 GPa and the flexural strength was 340 ± 17 MPa, which improved by about 150% compared to other rapid prototyping methods and has attractive application prospects.

Publisher

MDPI AG

Subject

General Materials Science

Reference25 articles.

1. Development of Reaction-Bonded Silicon Carbide;Wu;Bull. Chin. Silic. Soc.,2002

2. Research progress in bulletproof SiC ceramic and its applications in armor protection field;Wei;Ordnance Mater. Sci. Eng.,2014

3. Development of the Silicon Carbide Mirror and System in the World;Han;J. Mater. Eng.,2005

4. Development of Preparation of Silicon Carbide Dense Ceramics;Dai;China’s Ceram.,2012

5. Consolidation of Nanostructured β-SiC by Spark Plasma Sintering

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