Thermal Frequency Drift of 3D Printed Microwave Components

Abstract

Fabrication of microwave slot array antennas and waveguide bandpass and notch filters using 3D printing has significant advantages in terms of speed and cost even for parts with high mechanical complexity. One disadvantage of Stereolithography (SLA) 3D printed, copper plated microwave components is that some SLA resins have a high Coefficient of Thermal Expansion (CTE), quoted in micrometers per meter per degree or 10−6 per degree. Compared to typically used metals such as aluminum (CTE 24 × 10−6·K−1) and copper (CTE 17 × 10−6·K−1), SLA resin can have CTE above 100 × 10−6·K−1. Resonant structures experience significant frequency drift with temperature changes on the order of 10–50 °C. The issue of 3D printed microwave structures changing frequency characteristics significantly with temperature shift has not been addressed or reviewed in current literature. We measured and simulated the effect of temperature change on a slot array, cavity notch filters, and post loaded waveguide bandpass filters. We tested several types of SLA resin, different plating techniques, and also Direct Metal Laser Sintering (DMLS) and Binder Infusion metal 3D printing. Performance as a function of temperature is presented for these alternatives.