Fabrication and Characterization of Acicular Micro-Textured Copper Sheet Device for Low-Temperature Heat Radiation

Author:

Aizawa Tatsuhiko1ORCID,Nakata Hiroki2,Nasu Takeshi2

Affiliation:

1. Surface Engineering Design Laboratory, Shibaura Institute of Technology, Tokyo 144-0045, Japan

2. Ebina Denka Kogyo, Co., Ltd., Tokyo 144-0033, Japan

Abstract

An acicular microtextured sheet was developed as a heat radiation device from the high-temperature source to the cooling medium in the infrared (IR) spectrum. The copper surface was modified by acicular micro-texturing to place a semi-regular micro-/nano-cone structure onto it. FT-IR (Fourier transformation IR) spectroscopy was utilized to measure the transmittance diagram in near-IR to far-IR wavelengths. The wavelength (λ) of 6.7 μm, where the highest absorbance valley was detected in the diagram, was equivalent to the doubled size of the micro-cone average height, with Have = 3.3 μm; λ ~ 2 × Have. The electromagnetic waves in the far-IR wavelength were emitted by acicular micro-textured metallic sheets. The heat radiation transfer experiment was performed to describe this low-temperature heat radiation behavior. No temperature rise was detected on the black-colored polycarbonate (BC-PC) plate away from the bare copper sheet without textures, located on the high-temperature source. The temperature increased by 4 K on the BC-PC plate using the acicular textured copper sheet device. The emitter temperature also decreased significantly by 50 K or 50% of the heat source temperature.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Heat Transportation by Acicular Micro-Textured Device with Semi-Regular Alignment;Heat Transfer - Advances in Fundamentals and Applications [Working Title];2023-10-11

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