An Implementation of Trust Chain Framework with Hierarchical Content Identifier Mechanism by Using Blockchain Technology

Author:

Chen Hsing-ChungORCID,Irawan BambangORCID,Hsu Pei-Yu,Su Jhih-Sheng,Lin Chun-Wei (Jerry)ORCID,Prayitno ORCID,Putra Karisma TrinandaORCID,Damarjati Cahya,Weng Chien-ErhORCID,Liang Yao-Hsien,Chang Pi-Hsien

Abstract

Advances in information technology (IT) and operation technology (OT) accelerate the development of manufacturing systems (MS) consisting of integrated circuits (ICs), modules, and systems, toward Industry 4.0. However, the existing MS does not support comprehensive identity forensics for the whole system, limiting its ability to adapt to equipment authentication difficulties. Furthermore, the development of trust imposed during their crosswise collaborations with suppliers and other manufacturers in the supply chain is poorly maintained. In this paper, a trust chain framework with a comprehensive identification mechanism is implemented for the designed MS system, which is based and created on the private blockchain in conjunction with decentralized database systems to boost the flexibility, traceability, and identification of the IC-module-system. Practical implementations are developed using a functional prototype. First, the decentralized application (DApp) and the smart contracts are proposed for constructing the new trust chain under the proposed comprehensive identification mechanism by using blockchain technology. In addition, the blockchain addresses of IC, module, and system are automatically registered to InterPlanetary File System (IPFS), individually. In addition, their corresponding hierarchical CID (content identifier) values are organized by using Merkle DAG (Directed Acyclic Graph), which is employed via the hierarchical content identifier mechanism (HCIDM) proposed in this paper. Based on insights obtained from this analysis, the trust chain based on HCIDM can be applied to any MS system, for example, this trust chain could be used to prevent the counterfeit modules and ICs employed in the monitoring system of a semiconductor factory environment. The evaluation results show that the proposed scheme could work in practice under the much lower costs, compared to the public blockchain, with a total cost of 0.002094 Ether. Finally, this research is developed an innovation trust chain mechanism that could be provided the system-level security for any MS toward Industrial 4.0 in order to meet the requirements of both manufacturing innovation and product innovation in Sustainable Development Goals (SDGs).

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Reference56 articles.

1. Industry Market Research, Reports, and Statistics https://www.ibisworld.com/industry-statistics/market-size/manufacturing-united-states

2. Why Is There a Chip Shortage for Computers and Cars? https://www.bbc.com/news/technology-55936011

3. South Korea Factory Output Falls at Fastest Pace since May 2020 on Auto Chip Shortage https://www.reuters.com/markets/asia/skorea-factory-output-falls-fastest-pace-since-may-2020-auto-chip-shortage-2021-11-29/

4. A Novel Predictive Maintenance Method Based on Deep Adversarial Learning in the Intelligent Manufacturing System

5. Distributed scheduling problems in intelligent manufacturing systems

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3