Thermal-Imaging-Based PCA Method for Monitoring Process Temperature

Abstract

To overcome the shortage of traditional temperature sensors, this paper adopts infrared thermal imaging technology for temperature measurement. To avoid the spatial information loss issue during the image data vectorization process, this paper adopted the spatial relationship between pixels in principal component analysis (PCA) model training, which is called spatial information-based PCA (SIPCA). Then, spatial information is also used in the fault localization method to enhance the fault location performance. Tested by an experimental tank system, the proposed method achieves better performance than the traditional PCA approach, and it can detect heat leakage faults on the surface of the equipment.