Numerical Investigation of a Bionic Vapor Chamber Based on Leaf Veins for Cooling Electronic Devices

Abstract

In order to solve the problem of integrated heat dissipation in electronic chips under continuous high-intensity operation and thus ensure their stable and normal operation, a novel bionic vapor chamber with a composite structure of leaf vein grooves is proposed. Leaf veins produce effective nutrient transport; however, how the wick core of the leaf vein groove porous composite structure affects heat transfer and flow in the vapor chamber remains elusive. In this study, the effects of the groove parameters, including the central groove diameter (D), the ratio of the inner and outer circle diameter (γ), and the number of grooves (N), on the temperature, velocity, and pressure distribution of the bionic vapor chamber were investigated based on a simplified numerical model. The results show that the maximum temperature difference at the condensing surface was reduced by approximately 50% as compared to the conventional vapor chamber, implying better temperature homogeneity. In addition, the heat and mass transfer performance of the vapor chamber improved as parameter γ increased. Moreover, the effects of variations in parameters N and D on the performance of the vapor chamber were competitive, with larger values of parameters N and D enhancing the heat transfer performance of the vapor chamber, and smaller parameter values reducing the flow pressure drop of the liquid. This provides a reference for research on the optimization of bionic vapor chambers.