Numerical Analysis of Flow Boiling Characteristics of a Single Channel Heat Sink Subjected to Multiple Heat Sources
Author:
Qian Jiyu1,
Wang Rui1,
Wei Tao1,
Tang Hao2,
Hu Dinghua2
Affiliation:
1. Nanjing Research Institute of Electronics Technology, Nanjing 210094, China
2. MIIT Key Laboratory of Thermal Control of Electronic Equipment, School of Energy and Power Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
Abstract
High-power electronic devices with multiple heat sources often require temperature uniformity and to operate within their functional temperature range for optimal performance. Micro-channel cooling could satisfy the heat dissipation requirements, but it may cause temperature non-uniformity. In this paper, simulations are performed for different geometric parameters of the channel and the position of the heat source. The results show that a flattened channel can effectively reduce the heat source temperature, broadening the straight channel can reduce the flow resistance and enhance heat transfer, while widening the channel at the bend may lead to local dryness. Meanwhile, a thermal model is established to analyze the influence of the position of the heat source. The results also show that with the increase in the curved channel radius, the phenomenon of vapor–liquid separation becomes more obvious, the pressure drop decreases, but the heat transfer effect worsens.
Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Subject
Energy (miscellaneous),Energy Engineering and Power Technology,Renewable Energy, Sustainability and the Environment,Electrical and Electronic Engineering,Control and Optimization,Engineering (miscellaneous),Building and Construction
Reference24 articles.
1. Research status and development of high-efficiency heat pipe technology in electronic and electrical equipment;Yao;J. Jiangsu Univ. Sci. Technol. Nat. Sci. Ed.,2003
2. Development of heat dissipation technology of electronic equipment;Xie;Ship Electron. Eng.,2019
3. Wang, M.Y. (2018). Research on the Topology Structure of Micro-Channel Cooling Plate of Active Phased Array Antenna, University of Electronic Science and Technology of China.
4. Heat transfer in micro-channels;Palm;Micro-Scale Therm. Phys. Eng.,2001
5. Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages;Zhang;IEEE Trans. Compon. Packag. Technol.,2005