Skin Heat Transfer and Thermal Sensation Coupling Model under Steady Stimulation

Author:

Zhou Yijia1,Yu Hang1,Luo Maohui1ORCID,Zhou Xiang1

Affiliation:

1. School of Mechanical Engineering, Tongji University, Shanghai 201804, China

Abstract

Thermal sensation prediction models can help to evaluate complex thermal environments and guide the environment conditioning strategy. However, most existing models are established basing on the thermal status of the entire human body or local body parts, failing to reflect thermal sensation generating mechanism or micro-scale (centimeter-scale) thermal sensation. This study put forward a new thermal sensation predicting approach by coupling the skin heat transfer and the thermoreceptor impulse signals. The micro-scale thermal sensitivity data under steady stimuli were applied to bridging the objective heat transfer model and the subjective sensation model. The model contains a one-dimensional skin heat transfer equation and three sensation-generating equations: the thermoreceptor impulse equation, the psychosensory intensity equation, and the thermal sensation equation. The dimension of the skin heat transfer equation was determined through a skin temperature diffusion experiment, and the coefficients of the static/dynamic impulse in the thermoreceptor impulse equation and the thermal sensation equation were obtained through polynomial fitting using thermal sensitivity data. The validated mean absolute percentage error (MAPE) was 0.08 and 0.1 under cooling and heating stimuli, respectively. This new model can predict thermal sensation on the centimeter scale and be applied under different boundary conditions. In the future, the new model can be further developed by testing dynamic stimuli and other boundary conditions so that it can be applied to more complex thermal exposures.

Funder

National Natural Science Foundation of China

China National Key R&D Program during the 14th Five-year Plan Period

National Engineering Research Center of New Energy Vehicles and Power Systems

Shanghai Key Lab of Vehicle Aerodynamics and Vehicle Thermal Management Systems

Publisher

MDPI AG

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