Dynamic Yarn-Tension Detection Using Machine Vision Combined with a Tension Observer

Author:

Ji Yue12,Ma Jiedong12,Zhou Zhanqing23,Li Jinyi12,Song Limei12

Affiliation:

1. School of Control Science and Engineering, Tiangong University, Tianjin 300387, China

2. Tianjin Key Laboratory of Intelligent Control of Electrical Equipment, Tiangong University, Tianjin 300387, China

3. School of Electrical Engineering, Tiangong University, Tianjin 300387, China

Abstract

Machine vision can prevent additional stress on yarn caused by contact measurement, as well as the risk of hairiness and breakage. However, the speed of the machine vision system is limited by image processing, and the tension detection method based on the axially moving model does not take into account the disturbance on yarn caused by motor vibrations. Thus, an embedded system combining machine vision with a tension observer is proposed. The differential equation for the transverse dynamics of the string is established using Hamilton’s principle and then solved. A field-programmable gate array (FPGA) is used for image data acquisition, and the image processing algorithm is implemented using a multi-core digital signal processor (DSP). To obtain the yarn vibration frequency in the axially moving model, the brightest centreline grey value of the yarn image is put forward as a reference to determine the feature line. The calculated yarn tension value is then combined with the value obtained using the tension observer based on an adaptive weighted data fusion method in a programmable logic controller (PLC). The results show that the accuracy of the combined tension is improved compared with the original two non-contact methods of tension detection at a faster update rate. The system alleviates the problem of inadequate sampling rate using only machine vision methods and can be applied to future real-time control systems.

Funder

Science & Technology Development Fund of Tianjin Education Commission for Higher Education

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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