A Review on Thermal Properties of Hydrogels for Electronic Devices Applications

Abstract

Hydrogels, as a series of three-dimensional, crosslinked, hydrophilic network polymers, exhibit extraordinary properties in softness, mechanical robustness and biocompatibility, which have been extensively utilized in various fields, especially for electronic devices. However, since hydrogels contain plenty of water, the mechanical and electrochemical properties are susceptible to temperature. The thermal characteristics of hydrogels can significantly affect the performance of flexible electronic devices. In this review, recent research on the thermal characteristics of hydrogels and their applications in electronic devices is summarized. The focus of future work is also proposed. The thermal stability, thermoresponsiveness and thermal conductivity of hydrogels are discussed in detail. Anti-freezing and anti-drying properties are the critical points for the thermal stability of hydrogels. Methods such as introducing soluble ions and organic solvents into hydrogels, forming ionogels, modifying polymer chains and incorporating nanomaterials can improve the thermal stability of hydrogels under extreme environments. In addition, the critical solution temperature is crucial for thermoresponsive hydrogels. The thermoresponsive capacity of hydrogels is usually affected by the composition, concentration, crosslinking degree and hydrophilic/hydrophobic characteristics of copolymers. In addition, the thermal conductivity of hydrogels plays a vital role in the electronics applications. Adding nanocomposites into hydrogels is an effective way to enhance the thermal conductivity of hydrogels.