Heat Conduction and Microconvection in Nanofluids: Comparison between Theoretical Models and Experimental Results

Author:

Bovesecchi GianluigiORCID,Corasaniti SandraORCID,Costanza GirolamoORCID,Piccotti Fabio,Potenza Michele,Tata Maria ElisaORCID

Abstract

A nanofluid is a suspension consisting of a uniform distribution of nanoparticles in a base fluid, generally a liquid. Nanofluid can be used as a working fluid in heat exchangers to dissipate heat in the automotive, solar, aviation, aerospace industries. There are numerous physical phenomena that affect heat conduction in nanofluids: clusters, the formation of adsorbate nanolayers, scattering of phonons at the solid–liquid interface, Brownian motion of the base fluid and thermophoresis in the nanofluids. The predominance of one physical phenomenon over another depends on various parameters, such as temperature, size and volume fraction of the nanoparticles. Therefore, it is very difficult to develop a theoretical model for estimating the effective thermal conductivity of nanofluids that considers all these phenomena and is accurate for each value of the influencing parameters. The aim of this study is to promote a way to find the conditions (temperature, volume fraction) under which certain phenomena prevail over others in order to obtain a quantitative tool for the selection of the theoretical model to be used. For this purpose, two sets (SET-I, SET-II) of experimental data were analyzed; one was obtained from the literature, and the other was obtained through experimental tests. Different theoretical models, each considering some physical phenomena and neglecting others, were used to explain the experimental results. The results of the paper show that clusters, the formation of the adsorbate nanolayer and the scattering of phonons at the solid–liquid interface are the main phenomena to be considered when φ = 1 ÷ 3%. Instead, at a temperature of 50 °C and in the volume fraction range (0.04–0.22%), microconvection prevails over other phenomena.

Publisher

MDPI AG

Subject

Aerospace Engineering

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