Influence of the Elastic Modulus on the Osseointegration of Dental Implants

Author:

Brizuela Aritza,Herrero-Climent Mariano,Rios-Carrasco Elisa,Rios-Santos Jose,Pérez Roman,Manero Jose,Gil Mur Javier

Abstract

The load transfer from metallic prosthesis to tissue plays an important role in the success of a designed device. From a mechanical behavior point of view, the load transfer will be favored when the elastic modulus between the metallic implant and the bone tissue are similar. Titanium and Ti-6Al-4V are the most commonly used metals and alloys in the field of dental implants, although they present high elastic moduli and hence trigger bone resorption. We propose the use of low-modulus β-type titanium alloys that can improve the growth of new bone surrounding the implant. We designed dental implants with identical morphology and micro-roughness composed of: Ti-15Zr, Ti-19.1Nb-8.8Zr, Ti-41.2Nb-6.1Zr, and Ti-25Hf-25Ta. The commercially pure Ti cp and Ti-6Al-4V were used as control samples. The alloys were initially mechanically characterized with a tensile test using a universal testing machine. The results showed the lowest elastic modulus for the Ti-25Hf-25Ta alloy. We implanted a total of six implants in the mandible (3) and maxilla (3) for each titanium alloy in six minipigs and evaluated their bone index contact (i.e., the percentage of new bone in contact with the metal—BIC%) after 3 and 6 weeks of implantation. The results showed higher BIC% for the dental implants with lowest elastic modulus, showing the importance of decreasing the elastic modulus of alloys for the successful osseointegration of dental implants.

Publisher

MDPI AG

Subject

General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3