Evaluation of Surface Cleaning Procedures for CTGS Substrates for SAW Technology with XPS
Author:
Funder
Bundesministerium für Bildung und Forschung
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/10/12/1373/pdf
Reference19 articles.
1. Introduction;Kohli,2008
2. Cleaning with solvents;Durkee,2008
3. Cleaning solutions based on hydrogen peroxide for use in silicon semiconductor technology;Kern;RCA Rev.,1970
4. UV/ozone cleaning of surfaces
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