Effect of Temperature and Dwell Time on Fatigue Crack Growth Behavior of CP-Ti

Abstract

In this paper, the effects of temperature and dwell time on the Fatigue Crack Growth (FCG) behavior of commercial pure titanium were studied under high and low load ratios. Besides, combined with the fracture surface morphology, the specific characteristics of FCG were analyzed under pure fatigue and dwell fatigue conditions. The experiment results show that the FCG rate of commercial pure titanium (CP-Ti) increases with the temperature under low load ratio, and the dwell time increases the FCG rate. Also, the enhancement of the dwell time increases as the temperature rises. The dwell effect tends to be saturated when the temperature rises to 200 °C. Under high load ratio, the FCG rate of CP-Ti also exhibits a temperature-sensitive enhancement. The enhancement effect of the dwell time on the FCG rate under high load ratio is more significant. However, the effect of the hold time on the FCG rate does not increase at 300 °C. The da/dN–ΔK/E FCG curves for CP-Ti have a tendency to approach each other under different load ratios, which indicates that the E-modulus is an important factor for the difference. The effect of dwell time on the FCG behavior of CP-Ti is dominated by the creep deformation mechanism under different load ratios from room temperature to 300 °C. At the same time, the oxidation effect gradually becomes significant as the load ratio increases to 300 °C. The fracture surface morphology shows that the secondary cracks and the roughness increase with temperature or dwell time under low load ratio condition, while, under high load ratio, the effect of creep deformation on the FCG behavior is more obviously enhanced, and plastic deformation is gradually significant with increase of the dimples.