Preparation of Epoxy Resin with Disulfide-Containing Curing Agent and Its Application in Self-Healing Coating

Author:

Wang Baolei1,Li Zewei1,Liu Xinru1,Li Lulu1,Yu Jianxiang1,Li Shuang1,Guo Gaiping1,Gao Dahai1ORCID,Dai Yuhua1

Affiliation:

1. Beijing Key Laboratory of Special Elastomeric Composite Materials, Beijing Institute of Petrochemical Technology, College of New Materials and Chemical Engineering, Beijing 102617, China

Abstract

Intrinsic self-healing polymers via dynamic covalent bonds have been attracting extensive attention because of their repeatable self-healing property. Herein, a novel self-healing epoxy resin was synthesized with disulfide-containing curing agent via the condensation of dimethyl 3,3′-dithiodipropionate (DTPA) and polyether amine (PEA). Therefore, in the structure of cured resin, flexible molecular chains and disulfide bonds were imported into the cross-linked polymer networks for triggering self-healing performance. The self-healing reaction of cracked samples was realized under a mild condition (60 °C for 6 h). The distribution of flexible polymer segments, disulfide bonds and hydrogen bonds in cross-linked networks plays a great role in the self-healing process of prepared resins. The molar ratio of PEA and DTPA strongly affects the mechanical performance and self-healing property. Especially when that molar ratio of PEA to DTPA is 2, the cured self-healing resin sample showed great ultimate elongation (795%) and excellent healing efficiency (98%). The products can be used as an organic coating, in which the crack could self-repair during a limited time. The corrosion resistance of a typical cure coating sample has been testified by an immersion experiment and electrochemistry impedance spectrum (EIS). This work provided a simple and low-cost route to prepare a self-healing coating for prolonging the service life of conventional epoxy coatings.

Funder

National Natural Science Foundation of China

Scientific research project of Beijing Municipal Education Commission

Publisher

MDPI AG

Subject

General Materials Science

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