Affiliation:
1. Department of Mechanical & Materials Engineering, University of Cincinnati, Cincinnati, OH 45221, USA
Abstract
A metallic wire mesh screen, wire diameter of approximately 50 μm, is folded into ~80 “accordion-shaped” mini-channels and placed inside the evaporator package of a novel passive thermal management device for cooling overhead light-emitting diodes (LEDs) used in factory floors and high-bay facilities. The thermal power dissipated via these devices ranges between 75 W and 171 W. The channel walls (screen) wick liquid water from the porous wick (located centrally above the screen) and facilitate its evaporation. The closed-loop tests on this device confirm that the two-phase mixture quality exiting the evaporator is approximately 0.2. This paper presents a steady-state numerical model of this separated liquid–vapor flow in a single mini-rectangular channel (900 μm × 2000 μm, 4 cm long) with wire mesh-screen walls. The primary objective of the model is to estimate the pressure drops occurring in this two-phase flow. The model initially assumes a flat liquid–vapor interface along the channel and uses an iterative approach to estimate its final meniscus shape (curvature). In addition to the temperature distribution along the screen walls, this paper also discusses the velocity and pressure distributions in both liquid and vapor regions. It also helps understand the liquid–vapor interfacial shear in this flow configuration and proposes a flow-limiting condition for the device by predicting flow reversal in the channel.
Subject
Energy (miscellaneous),Energy Engineering and Power Technology,Renewable Energy, Sustainability and the Environment,Electrical and Electronic Engineering,Control and Optimization,Engineering (miscellaneous),Building and Construction