Implementation of Microwave Circuits Using Stereolithography

Abstract

In this work, the use of additive manufacturing techniques through stereolithography for the manufacture of high-frequency circuits and devices is presented. Both the resin and the 3D printer used in this research are general-purpose commercial materials, not specifically intended for the implementation of microwave networks. The manufacturing and metallization procedures used to produce substrates for the design of planar microwave circuits are described, introducing the characterization process carried out to determine the electrical properties of the resin used. The ultrasonic techniques that allow the structural analysis of the manufactured substrates are also described. The electrical characterization provides a relative dielectric permittivity of 3.25 and a loss tangent of 0.03 for the resin used. In addition, the structural analysis shows a homogeneity and a finish of the manufactured parts that is not achievable using fused deposition modeling techniques. Finally, as a proof of concept, the design and manufacture of a complex geometry stepped impedance filter on a multi-height substrate using stereolithography techniques is presented, which allows for reducing the size of the traditional implementation of the same filter while maintaining its high-frequency response performance.