In Situ Characterization of the Reaction-Diffusion Behavior during the Gradient Interphase Formation of Polyetherimide with a High-Temperature Epoxy System

Author:

Zweifel LucianORCID,Brauner ChristianORCID,Teuwen JulieORCID,Dransfeld ClemensORCID

Abstract

This study presents two novel methods for in situ characterization of the reaction-diffusion process during the co-curing of a polyetherimide thermoplastic interlayer with an epoxy-amine thermoset. The first method was based on hot stage experiments using a computer vision point tracker algorithm to detect and trace diffusion fronts, and the second method used space- and time-resolved Raman spectroscopy. Both approaches provided essential information, e.g., type of transport phenomena and diffusion rate. They can also be combined and serve to elucidate phenomena occurring during diffusion up to phase separation of the gradient interphase between the epoxy system and the thermoplastic. Accordingly, it was possible to distinguish reaction-diffusion mechanisms, describe the diffusivity of the present system and evaluate the usability of the above-mentioned methods.

Funder

Innosuisse - Swiss Innovation Agency

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

Reference61 articles.

1. Carbon Composites in Automotive Structural Applicationshttps://cutt.ly/CteyLEP

2. Thermoplastic Composites in Aerospace–the Future Looks Brighthttps://www.compositesworld.com/articles/thermoplastic-composites-in-aerospace-past-present-and-future

3. Toughening of Epoxy Systems with Interpenetrating Polymer Network (IPN): A Review

4. Thermoplastic toughening of epoxy resins: a critical review

Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3