Damage Analysis of Segmental Dry Joint Full-Scale Prestressed Cap Beam Based on Distributed Optical Fiber Sensing

Author:

Liu Duo1,Li Shengtao23,Casas Joan R.3ORCID,Chen Xudong2,Sun Yangyang4ORCID

Affiliation:

1. The State Key Laboratory on Safety and Health of In-Service Long-Span Bridges, JSTI Group, Nanjing 210019, China

2. College of Civil and Transportation Engineering, Hohai University, Nanjing 210098, China

3. Department of Civil and Environmental Engineering, Technical University of Catalunya, UPC-BarcelonaTech, Campus Nord, Calle Jordi Girona 1-3, 08034 Barcelona, Spain

4. College of Defense Engineering, PLA Army Engineering University, Nanjing 210014, China

Abstract

Distributed fiber optic sensors (DFOS) can detect structural cracks and structural deformation with high accuracy and wide measurement range. This study monitors the segmental prestressed bent cap, assembled with a large key dry joint, based on optical fiber technology, and it allows the comparison of its damaging process with that of a monolithic cast in place counterpart. The obtained results, comprising cross-section strain distributions, longitudinal strain profiles, neutral axis location, crack pattern, and the damage process, show that the DFOS technology can be successfully used to analyze the complex working stress state of the segmental beam with shear key joints, both in the elastic range and at the ultimate load, and to successfully identify the changing characteristics of the stress state of the segmental capping beam model when elastic beam theory no longer applies. The DFOS data confirm that the shear key joint, as the weak point of the segmental cap beam, results in the high stress concentration area, and the damage rate is higher than that of the cast-in-place beam. The accurate monitoring by the DFOS allows for the realization that the damage occurs at the premature formation of a concentrated compression zone on the upper part of the shear key.

Funder

National Natural Science Foundation of China

Qinghai Provincial Key R&D and Transformation Plan

CSC scholarship of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Reference37 articles.

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