Review on the Tensile Properties and Strengthening Mechanisms of Additive Manufactured CoCrFeNi-Based High-Entropy Alloys

Author:

Wu Zhining123,Wang Shanshan12,Jia Yunfeng12,Zhang Weijian12,Chen Ruiguang12,Cao Boxuan2,Yu Suzhu12ORCID,Wei Jun124

Affiliation:

1. Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China

2. School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China

3. School of Mechanical and Automotive Engineering, Ningbo University of Technology, Ningbo 315211, China

4. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

Abstract

The advent of high-entropy alloys (HEAs) provides new possibilities for the metallurgical community. CoCrFeNi-based alloys have been widely recognized to demonstrate superior mechanical properties, amongst the high-entropy alloy systems; in particular, they possess an outstanding tensile ductility and work-hardening capacity. Additive manufacturing (AM) uses a layer-by-layer material deposition approach to build parts directly from computer-aided design models, which are capable of producing near-net-shape HEAs with superior mechanical properties, surpassing traditional manufacturing methods that require a time-consuming post-treatment process, such as cutting, milling, and molding. Moreover, the rapid solidification inherent in AM processes induces the formation of high-density dislocations, which are capable of enhancing the mechanical properties of HEAs. This review comprehensively investigates and summarizes the diverse strengthening mechanisms within CoCrFeNi-based alloys produced using AM technologies, with a specific focus on their influence on tensile properties. A correlation is established between the AM processing parameters and the resultant phases and microstructures, as well as the mechanical properties of CoCrFeNi-based HEAs, which provide guidelines to achieve a superior strength–ductility synergy.

Funder

Shenzhen Science and Technology Program

National Natural Science Foundation of China

Shenzhen Research Fund for Returned Scholars

Publisher

MDPI AG

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