Deep Electrochemical Etching of Stainless Steel Using a Deposited Copper Layer

Abstract

Deep electrochemical etching (DEE) is proposed in this paper. DEE is a process that repeats steps consisting of electrodeposition, laser patterning, and electrochemical etching. In the electrodeposition step, a deposited layer is formed on the surface of the workpiece. This deposited layer serves as a protective layer to protect the surface of the workpiece until it is completely dissolved in the electrochemical etching step. Laser patterning is the step of patterning a deposited layer by irradiating a laser beam while minimizing surface damage to the workpiece. The etching of the workpiece proceeds through the electrochemical etching step. If these three steps are performed sequentially, one cycle of the DEE process is completed. By repeating this cycle, an improved etch factor can be obtained in the DEE process. The processing characteristics according to DEE process conditions were analyzed through an SEM and 3D surface profiler. Through the DEE process, a microstructure with a deep etching depth was fabricated, and the micropatterns successfully penetrated a one-hundred-um-thick stainless steel specimen. Through the DEE process, it was confirmed that it is possible to fabricate a micro with a high aspect ratio structure pattern by improving the etch factor.