Engineering of a FGM Interlayer to Reduce the Thermal Stresses Inside the PFCs

Author:

Dose Giacomo,Roccella Selanna,Romanelli Francesco

Abstract

A substantial contribution of the stresses that arise inside the Plasma-Facing Components (PFCs) when a heat load is applied is caused by the mismatch of the Coefficient of Thermal Expansion (CTE) between the armor, usually made of tungsten (W), and the heat sink. A potential way to reduce such contribution to the secondary stresses is the use of an interlayer made with a Functionally Graded Material (FGM), to be interposed between the two sub-components. By tailoring the W concentration in the volume of the FGM, one can engineer the CTE in such a way that the thermal stresses are reduced inside the PFC. To minimize and, theoretically, reduce to zero the stresses due to the CTE mismatch, the FGM should ensure kinematic continuity between the armor and the heat sink, in a configuration where they deform into exactly the shape they would assume if they were detached from each other. We will show how this condition occurs when the mean thermal strain of each sub-component is the same. This work provides a methodology to determine the thickness and the spatial concentration function of the FGM able to ensure the necessary kinematic continuity between the two sub-components subjected to a generic temperature field monotonously varying in the thickness, while remaining stress-free itself. A method for the stratification of such ideal FGM is also presented. Additionally, it will be shown that the bending of the PFC, if allowed by the kinematic boundary conditions, does not permit, at least generally, the coupling of the expansion of the armor and of the heat sink. As an example of our methodology, a study case of the thermomechanical design of a steel-based PFC with an engineered W/steel FGM interlayer is presented. In such an exercise, we show that our procedure of engineering a FGM interlayer is able to reduce the linearized secondary stress of more than 24% in the most critical section of the heat sink, satisfying all the design criteria.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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