A Digital Image Correlation Technique for Laboratory Structural Tests and Applications: A Systematic Literature Review

Author:

Mousa Mohammed Abbas12ORCID,Yussof Mustafasanie M.2ORCID,Hussein Thulfiqar S.13ORCID,Assi Lateef N.4,Ghahari SeyedAli5ORCID

Affiliation:

1. Department of Roads and Transportation, University of Al-Qadisiyah, Al Diwaniyah 58002, Iraq

2. Department of Civil Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Malaysia

3. Faculty of Civil Engineering, Universiti Teknologi Malaysia (UTM), Skudai 81310, Malaysia

4. Terracon Consultants Inc., 9522 E 47th Pl, Tulsa, OK 74145, USA

5. Department of Civil Engineering, Purdue University, West Lafayette, IN 47907, USA

Abstract

Digital image correlation (DIC) is an optical technique used to measure surface displacements and strains in materials and structures. This technique has demonstrated significant utility in structural examination and monitoring. This manuscript offers a comprehensive review of the contemporary research and applications that have leveraged the DIC technique in laboratory-based structural tests. The reviewed works encompass a broad spectrum of structural components, such as concrete beams, columns, pillars, masonry walls, infills, composite materials, structural joints, steel beams, slabs, and other structural elements. These investigations have underscored the efficacy of DIC as a metrological instrument for the precise quantification of surface deformation and strain in these structural components. Moreover, the constraints of the DIC technique have been highlighted, especially in scenarios involving extensive or complex test configurations. Notwithstanding these constraints, the effectiveness of the DIC methodology has been validated as a strain measurement instrument, offering numerous benefits such as non-invasive operation, full-field measurement capability, high precision, real-time surveillance, and compatibility with integration into other measurement instruments and methodologies.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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