UV/Ozone-Treated and Sol–Gel-Processed Y2O3 Insulators Prepared Using Gelation-Delaying Precursors

Author:

Lee Sangwoo1ORCID,Cho Yoonjin1ORCID,Heo Seongwon1,Bae Jin-Hyuk12ORCID,Kang In-Man12ORCID,Kim Kwangeun3ORCID,Lee Won-Yong14ORCID,Jang Jaewon12ORCID

Affiliation:

1. School of Electronic and Electrical Engineering, Kyungpook National University, Daegu 41566, Republic of Korea

2. School of Electronics Engineering, Kyungpook National University, Daegu 41566, Republic of Korea

3. School of Electronics and Information Engineering, Korea Aerospace University, Goyang 10540, Republic of Korea

4. The Institute of Electronic Technology, Kyungpook National University, Daegu 41566, Republic of Korea

Abstract

In this study, a Y2O3 insulator was fabricated via the sol–gel process and the effect of precursors and annealing processes on its electrical performance was studied. Yttrium(III) acetate hydrate, yttrium(III) nitrate tetrahydrate, yttrium isopropoxide oxide, and yttrium(III) tris (isopropoxide) were used as precursors, and UV/ozone treatment and high-temperature annealing were performed to obtain Y2O3 films from the precursors. The structure and surface morphologies of the films were characterized via grazing-incidence X-ray diffraction and scanning probe microscopy. Chemical component analysis was performed via X-ray spectroscopy. Electrical insulator characteristics were analyzed based on current density versus electrical field data and frequency-dependent dielectric constants. The Y2O3 films fabricated using the acetate precursor and subjected to the UV/ozone treatment showed a uniform and flat surface morphology with the lowest number of oxygen vacancy defects and unwanted byproducts. The corresponding fabricated capacitors showed the lowest current density (Jg) value of 10−8 A/cm2 at 1 MV/cm and a stable dielectric constant in a frequency range of 20 Hz–100 KHz. At 20 Hz, the dielectric constant was 12.28, which decreased to 10.5 at 105 Hz. The results indicate that high-quality, high-k insulators can be fabricated for flexible electronics using suitable precursors and the suggested low-temperature fabrication methods.

Funder

National Research Foundation of Korea

Publisher

MDPI AG

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