Experimental and Theoretical Study on Operation Characteristics of an Oscillating Heat Pipe

Author:

Ling Yunzhi12,Li Xiaozhao13,Zhang Xiaosong4,Liu Zhan13ORCID,Zhao Peng13

Affiliation:

1. School of Mechanics and Civil Engineering, China University of Mining and Technology, Xuzhou 221116, China

2. Yunlong Lake Laboratory of Deep Underground Science and Engineering, Xuzhou 221116, China

3. State Key Laboratory for Geomechanics and Deep Underground Engineering, China University of Mining & Technology, Xuzhou 221116, China

4. School of Energy and Environment, Southeast University, Nanjing 210096, China

Abstract

An oscillating heat pipe (OHP) is an effective heat transfer device for the thermal management of electronic devices. However, the heat transfer mechanism of the OHP was not fully understood due to its complicated operation characteristics. In this paper, the thermal performance of an OHP was experimentally studied. The condensation and evaporation temperature variations were monitored under different heat inputs and were then used to evaluate the OHP system operating characteristics. Thermal resistance was used as a key parameter to evaluate the thermal performance of the OHP system. The results indicated that as the heat input increased from 25 to 100 W, the average thermal resistance decreased while the stable evaporating and condensing temperatures increased. The equivalent heat transfer coefficient was derived theoretically. It showed that the reciprocal of the radial heat transfer coefficient increased with increasing liquid film thickness. Based on this result, an empirical correlation was proposed to evaluate the thermal resistance of an OHP system. This correlation was validated using both the experimental data provided in this study and the data collected from the open literature. The comparison results indicated that the proposed empirical correlation could reasonably predict the thermal resistance under different filling ratios and heat inputs.

Funder

Fundamental Research Funds for Central Universities

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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