Tensile Failure Behaviors of Adhesively Bonded Structure Based on In Situ X-ray CT and FEA

Abstract

Adhesive bonding plays a pivotal role in structural connections, yet the bonding strength is notably affected by the presence of pore defects. However, the invisibility of interior pores severely poses a challenge to understanding their influence on tensile failure behaviors under loading. In this study, we present a pioneering investigation into the real-time micro-failure mechanisms of adhesively bonded structures using in situ X-ray micro-CT. Moreover, the high-precision finite element analysis (FEA) of stress distribution is realized by establishing the real adhesive layer model based on micro-CT slices. The findings unveil that pores induce stress concentration within the adhesive layer during the tensile process, with stress levels significantly contingent upon pore sizes rather than their specific shapes. Consequently, larger pores initiate and propagate cracks along their paths, ultimately culminating in the failure of adhesively bonded structures. These outcomes serve as a significant stride in elucidating how pore defects affect the bonding performance of adhesively bonded structures, offering invaluable insights into their mechanisms.