Process Optimization of the Hot Stamping of AZ31 Magnesium Alloy Sheets Based on Response Surface Methodology

Author:

Zhao Pengjing1ORCID,Wu Qi1,Yang Yo-Lun2ORCID,Chen Zhanghua3

Affiliation:

1. Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China

2. Graduate Institute of Manufacturing Technology, National Taipei University of Technology, Taipei 106344, Taiwan

3. School of Mathematics and Physics, University of Science and Technology Beijing, Beijing 100083, China

Abstract

Hot stamping is an important manufacturing process for sheet metal parts. However, it is easy to produce defects such as thinning and cracking in the drawing area during the stamping process. In this paper, the finite element solver ABAQUS/Explicit was used to establish the numerical model of the magnesium alloy hot-stamping process. The stamping speed (2~10 mm/s), the blank-holder force (3~7 kN), and the friction coefficient (0.12~0.18) were selected as the influencing factors. Taking the maximum thinning rate obtained through simulation as the optimization objective, the response surface methodology (RSM) was applied to optimize the influencing factors in sheet hot stamping at a forming temperature of 200 °C. The results showed that the maximum thinning rate of sheet metal was most influenced by the blank-holder force, and the interaction between the stamping speed and the blank-holder force/friction coefficient had a great influence on the maximum thinning rate. The optimal value of the maximum thinning rate of the hot-stamped sheet was 7.37%. Through the experimental verification for the hot-stamping process scheme, the maximum relative error between the simulation and the experimental results was 8.72%. This proves the accuracy of the established finite element model and the response surface model. This research provides a feasible optimization scheme for the analysis of the hot-stamping process of magnesium alloys.

Funder

Natural Science Foundation of China

International Research Cooperation Seed Fund of Beijing University of Technology

Faculty of Materials and Manufacturing, Beijing University of Technology

Publisher

MDPI AG

Subject

General Materials Science

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