Cooling Enhancement and Stress Reduction Optimization of Disk-Shaped Electronic Components Using Nanofluids

Abstract

Mechanical strength and thermal properties may limit the usage of an electronic component in the high-tech industry. This paper investigated the influence of using CuO nanoparticles in a radial configuration microchannel of a disk from the mechanical and thermal points of view. In this regard, a disk under thermal and mechanical loading had been considered. The cooling setup consisted of a radial configuration microchannel with a constant fluid volume. Water was used as the base fluid and CuO particles were used as the coolant fluid. The results showed that the use of CuO nanoparticles would reduce the maximum disk temperature, the maximum thermal stress, and the maximum stress, as well as the maximum deformation on the body. The increasing number of channels would increase the maximum stress in the object as well. Another remarkable point was that increasing the nanoparticles did not necessarily lead to a more uniform heat distribution in the disk.