Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”-Reference-Cited by-同舟云学术

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Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”

Published:2022-05-09 Issue:5 Volume:13 Page:749
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Seok Seonho^ORCID

Abstract

As fabrication technologies advance, the packaging of MEMS device is being developed in two main directions: MEMS device packaging and MEMS or sensor system integration [...]

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Link

https://www.mdpi.com/2072-666X/13/5/749/pdf

Reference31 articles.

1. A study on wafer level vacuum packaging for MEMS devices

2. Study of the Absorption of Electromagnetic Radiation by 3D, Vacuum-Packaged, Nano-Machined CMOS Transistors for Uncooled IR Sensing

3. Mechanical Design and Characterization for MEMS Thin-Film Packaging

4. Use of nanoporous columnar thin film in the wafer-level packaging of MEMS devices

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Atomically Precise Manufacturing of Silicon Electronics;ACS Nano;2024-02-20

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