Simulation of Temperature Field in Micro-EDM Assisted Machining of Micro-Holes in Printed Circuit Boards

Abstract

High-speed mechanical drilling based on the micro-bit is the mainstream process technology for machining micro-holes in the printed circuit board (PCB). However, the above process to obtain PCB micro-holes is prone to defects, such as hole burrs and nail heads in the hole. In this paper, the micro electrical discharge machining (micro-EDM) was used as an auxiliary means for machining PCB micro-holes to effectively eliminate the defects such as hole burrs and nail heads. However, during the process of micro-EDM, the micro-bit will be gradually worn, thus negatively affecting the machining quality of PCB micro-holes. To solve the above problems, in this paper, the temperature field model of micro-EDM-assisted machining of PCB micro-holes was established to predict the micro-bit wear by analyzing the temperature field with COMSOL Multiphysics software. This paper made an extensive study of the influences of spindle speed, machining voltage, and pulse width on temperature field and micro-bit wear. The simulation results show that with the increase in machining voltage and pulse width, the temperature of PCB micro-hole machining increases, resulting in an increase in micro-bit wear. The spindle rotation is beneficial to the updating of the machining medium and the discharge of heat generated from EDM. Therefore, with the increase in spindle speed, the temperature of PCB micro-hole machining and the micro-bit wear is reduced.