Molecular Dynamics Study on Mechanical Properties of Nanopolycrystalline Cu–Sn Alloy

Abstract

Molecular dynamics simulation is one kinds of important methods to research the nanocrystalline materials which is difficult to be studied through experimental characterization. In order to study the effects of Sn content and strain rate on the mechanical properties of nanopolycrystalline Cu–Sn alloy, the tensile simulation of nanopolycrystalline Cu–Sn alloy was carried out by molecular dynamics in the present study. The results demonstrate that the addition of Sn reduces the ductility of Cu–Sn alloy. However, the elastic modulus and tensile strength of Cu–Sn alloy are improved with increasing the Sn content initially, but they will be reduced when the Sn content exceeds 4% and 8%, respectively. Then, strain rate ranges from 1 × 109 s−1 to 5 × 109 s−1 were applied to the Cu–7Sn alloy, the results show that the strain rate influence elastic modulus of nanopolycrystalline Cu–7Sn alloy weakly, but the tensile strength and ductility enhance obviously with increasing the strain rate. Finally, the microstructure evolution of nanopolycrystalline Cu–Sn alloy during the whole tensile process was studied. It is found that the dislocation density in the Cu–Sn alloy reduces with increasing the Sn content. However, high strain rate leads to stacking faults more easily to generate and high dislocation density in the Cu–7Sn alloy.