Studies on the Mechanical Models and Behaviors for the Stamp/Film Interface in Microtransfer Printing

Abstract

The adhesion/delamination characteristics at the stamp/film interface are critical for the efficiency of film microtransfer printing technology. To predict and regulate the interface mechanical behaviors, finite element models based on the J-integral, Virtual Crack Closure Technology (VCCT), and the cohesive zone method (CZM) were established and compared. Then, the effects of pulling speed and interface parameters on the pull-off force, which is used to characterize the interface adhesion strength, were investigated. Comparisons between the simulation results and previous experimental results demonstrated that the model based on the CZM was more applicable than the models based on the J-integral and VCCT in analyzing the adhesion/delamination behaviors of the stamp/film interface. Furthermore, the increase in pulling speed could enlarge the pull-off force for the viscoelastic stamp/film interface, while it had no influence on the pull-off force for the elastic stamp/film interface. In addition, a larger normal strength and normal fracture energy resulted in a larger pull-off force, which was beneficial to the realization of the picking-up process in microtransfer printing.