Oversized Planer Shavings for the Core Layer of Lightweight Particleboard

Author:

Gößwald Jakob,Barbu Marius CătălinORCID,Petutschnigg Alexander,Krišťák Ľuboš,Tudor Eugenia MarianaORCID

Abstract

Planer shavings (PS) are side-products generated during the processing of solid wood, typically used for heating, packaging, or insulation purposes. PS has been used for decades in particleboard manufacture, particularly in the core layer. The aim of this research is to investigate the use of PS with a length over 4 mm in low-density one-layer particleboard manufacturing with a thickness of 10 mm, as an option to reduce the raw material demand for wood-based panels. Correlations towards the mechanical properties of the particleboards, fabricated at a density of 475 kg/m3, could be drawn by analyzing the effects of different urea-formaldehyde adhesive contents (6%, 9%, and 12%). Two methods of adhesive application (pouring and spraying) and two types of blending of PS with adhesive (plowshare mixer and drum mixer) were investigated, with the aim that PS will have controlled resin application. The difference between the adhesive application methods was examined by analyzing the mechanical properties as an internal bond, modulus of rupture, and modulus of elasticity as well as indirectly by visualizing the adhesive distribution by adding a green pigment to the adhesive before application. PS demonstrated reduced bending properties in comparison with the EN 312 standard requirements of particleboards for internal use in dry conditions (type P2), due to the low density. The internal bond strength in the case of the particleboard without pigment application (up to 0.5 N/mm2) was higher compared to the P2 requirements (0.4 N/mm2), and significantly lower (0.15 N/mm2) in combination with the pigment (2.5% based on the board weight, compared to 0.1%, specific for such industry applications), but still superior to the values of the reference panel manufactured with wood particles.

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

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