Self-Shielding of X-ray Emission from Ultrafast Laser Processing Due to Geometrical Changes of the Interaction Zone

Abstract

Materials processing with ultrashort laser pulses is one of the most important approaches when it comes to machining with very high accuracy. High pulse repetition rates and high average laser power can be used to attain high productivity. By tightly focusing the laser beam, the irradiances on the workpiece can exceed 1013 W/cm2, and thus cause usually unwanted X-ray emission. Pulsed laser processing of micro holes exhibits two typical features: a gradual increase in the irradiated surface within the hole and, with this, a decrease in the local irradiance. This and the shielding by the surrounding material diminishes the amount of ionizing radiation emitted from the process; therefore, both effects lead to a reduction in the potential X-ray exposure of an operator or any nearby person. The present study was performed to quantify this self-shielding of the X-ray emission from laser-drilled micro holes. Percussion drilling in standard air atmosphere was investigated using a laser with a wavelength of 800 nm a pulse duration of 1 ps, a repetition rate of 1 kHz, and with irradiances of up to 1.1·1014 W/cm. The X-ray emission was measured by means of a spectrometer. In addition to the experimental results, we present a model to predict the expected X-ray emission at different angles to the surface. These calculations are based on raytracing simulations to obtain the local irradiance, from which the local X-ray emission inside the holes can be calculated. It was found that the X-ray exposure measured in the surroundings strongly depends on the geometry of the hole and the measuring direction, as predicted by the theoretical model.