Study on the Heat Source Insulation of a Thermal Bubble-Driven Micropump with Induction Heating

Author:

Liu Bendong,Ma Chenxu,Yang Jiahui,Li Desheng,Liu Haibin

Abstract

Thermal bubble-driven micropumps have the advantages of high reliability, simple structure and simple fabrication process. However, the high temperature of the thermal bubble may damage some biological or chemical properties of the solution. In order to reduce the influence of the high temperature of the thermal bubbles on the pumped liquid, this paper proposes a kind of heat insulation micropump driven by thermal bubbles with induction heating. The thermal bubble and its chamber are designed on one side of the main pumping channel. The high temperature of the thermal bubble is insulated by the liquid in the heat insulation channel, which reduces the influence of the high temperature of the thermal bubble on the pumped liquid. Protypes of the new micropump with heat source insulation were fabricated and experiments were performed on them. The experiments showed that the temperature of the pumped liquid was less than 35 °C in the main pumping channel.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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