Advanced Electronic Packaging Technology: From Hard to Soft
Author:
Affiliation:
1. School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China
2. Department of Neurosurgery, Yale University, New Haven, CT 06520, USA
Abstract
Funder
National Natural Science Foundation of China
Publisher
MDPI AG
Subject
General Materials Science
Link
https://www.mdpi.com/1996-1944/16/6/2346/pdf
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