Room Temperature Strengthening and High-Temperature Superplasticity of Mg-Li-Al-Sr-Y Alloy Fabricated by Asymmetric Rolling and Friction Stir Processing

Author:

Cao Furong12ORCID,Xiang Chao1,Kong Shuting1,Guo Nanpan1,Shang Huihui13

Affiliation:

1. School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China

2. State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang 110819, China

3. AVIC Xi’an Aircraft Industry Group Company Ltd., Xi’an 710089, China

Abstract

Magnesium-lithium alloy is the lightest alloy to date. To explore its room temperature strength and high-temperature ductility, a plate of a new fine-grained Mg-9.13Li-3.74Al-0.31Sr-0.11Y alloy was fabricated by asymmetric rolling, and the rolled plate was subjected to friction stir processing (FSP). The microstructure and mechanical properties at room and elevated temperatures were investigated by optical microscopy, X-ray diffraction (XRD), energy dispersive spectroscopy (EDS), and tensile tester. Grain refinement with an average grain size in the α-Mg phase of 1.65 μm and an average grain size in the β-Li phase of 4.24 μm was achieved in the water-cooled FSP alloy. For room temperature behavior, the ultimate tensile strength of 208 ± 4 MPa, yield strength of 193 ± 2 MPa, and elongation of 48.2% were obtained in the water-cooled FSP alloy. XRD and EDS analyses revealed that the present alloy consists of α-Mg and β-Li phases, Al2Y, Al4Sr, MgLi2Al, and AlLi intermetallic compounds. For high-temperature behavior, the maximum superplasticity or ductility of 416% was demonstrated in this fine-grained alloy with an average grain size of 10 μm at 573 K and 1.67 × 10−3 s−1. A power-law constitutive equation was established. The stress exponent was 2.29 (≈2) (strain rate sensitivity 0.44), and the deformation activation energy was 162.02 kJ/mol. This evidence confirmed that the dominant deformation mechanism at elevated temperatures is grain boundary and interphase boundary sliding controlled by lattice diffusion.

Publisher

MDPI AG

Subject

General Materials Science

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