Effects of Low-Temperature Heat Treatment on Mechanical and Thermophysical Properties of Cu-10Sn Alloys Fabricated by Laser Powder Bed Fusion

Author:

Honu Edem1ORCID,Emanet Selami2ORCID,Chen Yehong2ORCID,Zeng Congyuan1ORCID,Mensah Patrick1

Affiliation:

1. Department of Mechanical Engineering, Southern University and A & M College, Baton Rouge, LA 70807, USA

2. Department of Mechanical & Industrial Engineering, Louisiana State University, Baton Rouge, LA 70803, USA

Abstract

This study investigated the impact of low-temperature heat treatments on the mechanical and thermophysical properties of Cu-10Sn alloys fabricated by a laser powder bed fusion (LPBF) additive manufacturing (AM) process. The microstructure, phase structure, and mechanical and thermal properties of the LPBF Cu-10Sn samples were comparatively investigated under both the as-fabricated (AF) condition and after low-temperature heat treatments at 140, 180, 220, 260, and 300 °C. The results showed that the low-temperature heat treatments did not significantly affect the phase and grain structures of the Cu-10Sn alloys. Both pre- and post-treatment samples displayed consistent grain sizes, with no obvious X-ray diffraction angle shift for the α phase, indicating that atom diffusion of the Sn element is beyond the detection resolution of X-ray diffractometers (XRD). However, the 180 °C heat-treated sample exhibited the highest hardness, while the AF samples had the lowest hardness, which was most likely due to the generation of precipitates according to thermodynamics modeling. Heat-treated samples also displayed higher thermal diffusivity values than their AF counterpart. The AF sample had the longest lifetime of ~0.19 nanoseconds (ns) in the positron annihilation lifetime spectroscopy (PALS) test, indicating the presence of the most atomic-level defects.

Funder

US National Science Foundation

Louisiana NASA EPSCoR Research Awards Program

Louisiana NASA EPSCoR Research Enhancement Award

Louisiana Board of Regents for the Louisiana Materials Design Alliance

Publisher

MDPI AG

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