3D Printing and Surface Engineering of Ti6Al4V Scaffolds for Enhanced Osseointegration in an In Vitro Study

Author:

Ma Changyu12ORCID,de Barros Natan Roberto2,Zheng Tianqi23ORCID,Gomez Alejandro12ORCID,Doyle Marshall1,Zhu Jianhao12,Nanda Himansu Sekhar24ORCID,Li Xiaochun3ORCID,Khademhosseini Ali2,Li Bingbing12ORCID

Affiliation:

1. Autonomy Research Center for STEAHM, California State University Northridge, Northridge, CA 91324, USA

2. Terasaki Institute for Biomedical Innovation, Los Angeles, CA 90024, USA

3. Department of Mechanical and Aerospace Engineering, University of California Los Angeles, Los Angeles, CA 90095, USA

4. Discipline of Mechanical Engineering, Indian Institute of Information Technology, Design and Manufacturing, Jabalpur 482005, India

Abstract

Ti6Al4V superalloy is recognized as a good candidate for bone implants owing to its biocompatibility, corrosion resistance, and high strength-to-weight ratio. While dense metal implants are associated with stress shielding issues due to the difference in densities, stiffness, and modulus of elasticity compared to bone tissues, the surface of the implant/scaffold should mimic the properties of the bone of interest to assure a good integration with a strong interface. In this study, we investigated the additive manufacturing of porous Ti6Al4V scaffolds and coating modification for enhanced osteoconduction using osteoblast cells. The results showed the successful fabrication of porous Ti6Al4V scaffolds with adequate strength. Additionally, the surface treatment with NaOH and Dopamine Hydrochloride (DOPA) promoted the formation of Dopamine Hydrochloride (DOPA) coating with an optimized coating process, providing an environment that supports higher cell viability and growth compared to the uncoated Ti6Al4V scaffolds, as demonstrated by the higher proliferation ratios observed from day 1 to day 29. These findings bring valuable insights into the surface modification of 3D-printed scaffolds for improved osteoconduction through the coating process in solutions.

Funder

MUREP High Volume

MUREP Institutional Research Opportunity

U.S. NASA’s Office of STEM Engagement, and Defense Manufacturing Community Support Program

U.S. Department of Defense’s Office of Local Defense Community Cooperation

U.S. Air Force Office of Scientific Research (AFOSR) DURIP

Publisher

MDPI AG

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