Fabrication and Assembly Techniques for Sub-mm Battery-Free Epicortical Implants-Reference-Cited by-同舟云学术

Fabrication and Assembly Techniques for Sub-mm Battery-Free Epicortical Implants

Published:2023-02-18 Issue:2 Volume:14 Page:476
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Khalifa Adam¹^ORCID,Nasrollahpour Mehdi²^ORCID,Nezaratizadeh Ali¹^ORCID,Sha Xiao³,Stanaćević Milutin³,Sun Nian X.²,Cash Sydney S.⁴

Affiliation:

1. Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL 32611, USA

2. Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115, USA

3. Department of Electrical and Computer Engineering, Stony Brook University, Stony Brook, NY 11794, USA

4. Department of Neurology, Massachusetts General Hospital, Harvard Medical School, Boston, MA 02114, USA

Abstract

Over the past three decades, we have seen significant advances in the field of wireless implantable medical devices (IMDs) that can interact with the nervous system. To further improve the stability, safety, and distribution of these interfaces, a new class of implantable devices is being developed: single-channel, sub-mm scale, and wireless microelectronic devices. In this research, we describe a new and simple technique for fabricating and assembling a sub-mm, wirelessly powered stimulating implant. The implant consists of an ASIC measuring 900 × 450 × 80 µm3, two PEDOT-coated microelectrodes, an SMD inductor, and a SU-8 coating. The microelectrodes and SMD are directly mounted onto the ASIC. The ultra-small device is powered using electromagnetic (EM) waves in the near-field using a two-coil inductive link and demonstrates a maximum achievable power transfer efficiency (PTE) of 0.17% in the air with a coil separation of 0.5 cm. In vivo experiments conducted on an anesthetized rat verified the efficiency of stimulation.

Funder

NIH

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Link

https://www.mdpi.com/2072-666X/14/2/476/pdf

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