Composite of Poly(Vinyl Chloride) Plastisol and Wood Flour as a Potential Coating Material

Author:

Siekierka Przemysław1ORCID,Makarewicz Edwin1,Wilczewski Sławomir1ORCID,Lewandowski Krzysztof1ORCID,Skórczewska Katarzyna1ORCID,Mirowski Jacek1,Osial Magdalena2ORCID

Affiliation:

1. Faculty of Chemical Technology and Engineering, Bydgoszcz University of Technology, 3 Seminaryjna Street, 85-326 Bydgoszcz, Poland

2. Institute of Fundamental Technological Research, Polish Academy of Sciences, 5B Pawińskiego Street, 02-106 Warsaw, Poland

Abstract

This paper presents the results of a study of the properties of a new composite material made from poly(vinyl chloride) plastisol (PVC) and conifer-derived wood flour. The material can be used for thermal insulation, floor coverings with high resistance to mechanical trauma, and protective coatings. The plastisol was made from emulsion poly(vinyl chloride), the plasticiser was bis(2-ethylhexyl) adipate, and the stabiliser was octyltin mercapeptide. Two types of flour were used: fine-grained and coarse-grained. Its properties, such as bulk density, oil number, and plasticiser number, were determined. The polymer-wood composite contained 20 or 30 wt.% wood flour in PVC. Plastisol was obtained by repeated mixing, mashing, and venting under vacuum. The produced composite material was gelated at temperatures of 130, 150, and 170 °C. The gelation process of the composites was studied in a Brabender apparatus. Samples in the form of polymer films were used to study density, hardness, thermal stability, and mechanical and thermomechanical properties. The structure of the composites was observed by scanning electron microscopy (SEM). A summary of all test results showed that composite films made from PVC plastisol with 20 wt.% of fine wood flour gelled at 150 °C had the most favourable physical, mechanical, and thermal properties.

Funder

Ministry of Education and Science in Poland

Publisher

MDPI AG

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces

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