Improved the Wear Resistance of Ti/Cu Multilayer Film by Nitriding

Abstract

In this study, Ti/Cu multilayer film was deposited by magnetron sputtering and then nitrided at 800 and 900 °C in N2. The microstructure and wear performance were studied. The deposited Ti/Cu multilayer film mainly consisted of Ti and Cu phases. After nitriding, the film mainly consisted of Cu4Ti3, CuTi, and TiN phases, indicating the interface reaction and nitriding reaction occurring. The surface microstructure of the Ti/Cu multilayer film became denser after nitridation. The wear resistance of the Ti/Cu multilayer film improved after nitriding. After nitriding at 900 °C for 2 h, the maximum wear track depth of the multilayer film was ~0.73 μm, which is just 65% of the deposited Ti/Cu multilayer film. The wear mechanism of the Ti/Cu multilayer film before and after nitriding was abrasive and adhesive wear.