Rapid Detection and Elimination of Subsurface Mechanical Damage for Improving Laser-Induced Damage Performance of Fused Silica

Abstract

The fabrication of SSD-free fused silica optics is a crucial objective for high-power laser applications. To treat the surface of polished fused silica, a combination of RIE/RIBE and deep-controlled etch (DCE) techniques are typically employed. Currently, it is important to consider and study the ideal etching depth and precision while using combined etching techniques to remove the identified SSD. Herein, we present a novel approach to identify the distribution of SSD in fused silica, which corresponds to a specific grinding/polishing process condition. Our method involves using a mobile RIBE to perform cone cutting and remove material from the polished fused silica surface. Afterward, we etch the optical element’s surface with HF to visualize the subsurface cracks and understand their relationship with the RIBE depth. Through a systematic investigation of the combined etching technique, we establish a correlation between the depth of RIBE and DCE and the performance of laser damage. The combined etching technique can be implemented as a dependable approach to treat the surface/subsurface defects in fused silica and has the potential to improve laser damage resistance significantly.