Effect of Ultrasonic Vibration on Microstructure and Antifouling Capability of Cu-Modified TiO2 Coating Produced by Micro-Arc Oxidation

Author:

Hu Pengfei1,Zhu Liyang12,Liu Jiejun3,Lv You2,Cai Guangyi1ORCID,Zhang Xinxin2

Affiliation:

1. National Key Laboratory of Electromagnetic Energy, Naval University of Engineering, Wuhan 430033, China

2. Key Laboratory of Material Chemistry for Energy Conversion and Storage, Hubei Key Laboratory of Material Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Ministry of Education, 1037 Luoyu Road, Hongshan District, Wuhan 430074, China

3. Xiangtan Electric Power Co., Ltd., Xiangtan 411101, China

Abstract

Ti and its alloys have received wide attention in marine engineering. However, the limited anti-biofouling capability may hinder their wide application. In the present work, micro-arc oxidation (MAO) with and without the introduction of ultrasonic vibration (UV) has been conducted on metallic Ti substrate in an aqueous solution containing Na2Cu-EDTA to produce a Cu-modified TiO2 coating. Microstructural characterization reveals that the introduction of UV increased the thickness of the coating (ranging from ~13.5 μm to ~26.2 μm) compared to the coating (ranging from ~8.1 μm to ~12.8 μm) without UV. A relatively higher Cu content (~2.13 wt.%) of the coating with UV relative to the coating (~1.39 wt.%) without UV indicates that UV enhances the incorporation of Cu into TiO2. Further, both electrochemical properties and the response to sulfate-reducing bacteria (SRB) were evaluated, revealing that UV introduction endows Cu-modified TiO2 coating with enhanced corrosion resistance and antifouling capability. The present results suggest that ultrasound-auxiliary micro-arc oxidation (UMAO) obviously enhances the surface performance of Ti alloys for promising applications in marine engineering.

Funder

National Natural Science Foundation of China

Hubei Provincial Natural Science Foundation of China

Publisher

MDPI AG

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